Intel Core i9-10850K processor 3.6 GHz 20 MB Smart Cache Box
Intel Core i9-10850K. Processor family: Intel® Core™ i9, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. On-board graphics card model: Intel® UHD Graphics 630, Maximum on-board graphics card memory: 64 GB, On-board graphics card base frequency: 350 MHz. Market segment: Desktop, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Max Technology 3.0 frequency: 5.1 GHz, Intel® Turbo Boost Technology 2.0 frequency: 5 GHz, Intel® Thermal Velocity Boost Temperature: 70 °C
Add to Favorites
- Processor family
- 10th gen Intel® Core™ i9
- Processor cache type
- Smart Cache
- Processor boost frequency
- 5.2 GHz
- Processor codename
- Comet Lake
- Processor cache
- 20 MB
- Processor operating modes
- 64-bit
- Processor frequency
- 3.6 GHz
- Processor cores
- 10
- Processor socket
- LGA 1200 (Socket H5)
- Component for
- PC
- Processor lithography
- 14 nm
- Box
- Y
- Processor model
- i9-10850K
- Processor threads
- 20
- System bus rate
- 8 GT/s
- Tjunction
- 100 °C
- Intel Turbo Boost Max Technology 3.0
- Y
- Intel Virtualization Technology for Directed I/O (VT-d)
- Y
- Intel VT-x with Extended Page Tables (EPT)
- Y
- Intel Virtualization Technology (VT-x)
- Y
- Intel Stable Image Platform Program (SIPP)
- N
- Intel 64
- Y
- Intel® Secure Key
- Y
- Intel® OS Guard
- Y
- Intel® Clear Video HD Technology (Intel® CVT HD)
- Y
- Intel® Identity Protection Technology (Intel® IPT)
- Y
- Intel Trusted Execution Technology
- N
- Intel® AES New Instructions (Intel® AES-NI)
- Y
- Enhanced Intel SpeedStep Technology
- Y
- Intel® Hyper Threading Technology (Intel® HT Technology)
- Y
- Intel® Quick Sync Video Technology
- Y
- InTru™ 3D Technology
- Y
- Intel® Turbo Boost Technology
- 2.0
- Intel Software Guard Extensions (Intel SGX)
- Y
- Intel Clear Video Technology
- Y
- Thermal Monitoring Technologies
- Y
- Scalability
- 1S
- CPU configuration (max)
- 1
- Embedded options available
- N
- Thermal solution specification
- PCG 2015D
- Execute Disable Bit
- Y
- Idle States
- Y
- Maximum number of PCI Express lanes
- 16
- PCI Express slots version
- 3.0
- PCI Express configurations
- 1x16,2x8,1x8+2x4
- Supported instruction sets
- SSE4.1,SSE4.2,AVX 2.0
- Configurable TDP-down
- 95 W
- Configurable TDP-down frequency
- 3300 MHz
- On-board graphics adapter
- Y
- On-board graphics adapter refresh rate at maximum resolution (HDMI)
- 30 Hz
- On-board graphics adapter DirectX version
- 12.0
- On-board graphics adapter OpenGL version
- 4.5
- On-board graphics adapter maximum resolution (HDMI)
- 4096 x 2160 pixels
- On-board graphics adapter 4K support
- Y
- On-board graphics adapter model
- Intel® UHD Graphics 630
- On-board graphics adapter base frequency
- 350 MHz
- On-board graphics adapter dynamic frequency (max)
- 1200 MHz
- Maximum on-board graphics adapter memory
- 64 GB
- Number of displays supported (on-board graphics)
- 3
- Maximum internal memory supported by processor
- 128 GB
- Memory types supported by processor
- DDR4-SDRAM
- Memory clock speeds supported by processor
- 2933 MHz