Intel 540. Processor family: Intel® Celeron® M, Processor socket: Socket 478, Processor lithography: 65 nm. Market segment: Mobile, Number of Processing Die Transistors: 291 M, Processing Die size: 143 mm². Package width: 152 mm, Package depth: 242 mm, Package height: 141 mm. Processor package size: 35mm x 35mm. Cache memory: 1 MB

Intel Xeon E5-2403. Processor family: Intel® Xeon® E5 Family, Processor socket: LGA 1356 (Socket B2), Processor lithography: 32 nm. Memory channels: Triple-channel, Maximum internal memory supported by processor: 375 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Package width: 44 mm, Package depth: 140 mm, Package height: 117 mm. Processor package size: 45mm x 42.5mm

Intel Core BX8071513700. Processor family: Intel® Core™ i7, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. On-board graphics card model: Intel UHD Graphics 770, On-board graphics card outputs supported: Embedded DisplayPort (eDP) 1.4b, DisplayPort 1.4a, HDMI 2.1, On-board graphics card base frequency: 300 MHz. Market segment: Desktop, Use conditions: PC/Client/Tablet, Workstation, PCI Express slots version: 5.0, 4.0. Intel® Turbo Boost Max Technology 3.0 frequency: 5.2 GHz

Intel Core i9-13900F. Processor family: Intel® Core™ i9, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 192 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express slots version: 5.0, 4.0. Intel® Turbo Boost Max Technology 3.0 frequency: 5.5 GHz, Intel® Thermal Velocity Boost Frequency: 5.6 GHz. Package type: Retail box