Intel Core i7-6900K. Processor family: Intel® Core™ i7 X-series, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Desktop, Scalability: 1S, Export Control Classification Number (ECCN): 5A992C. Intel® Turbo Boost Max Technology 3.0 frequency: 4 GHz. Package width: 44 mm, Package depth: 116 mm, Package height: 101 mm

Intel 540. Processor family: Intel® Celeron® M, Processor socket: Socket 478, Processor lithography: 65 nm. Market segment: Mobile, Number of Processing Die Transistors: 291 M, Processing Die size: 143 mm². Package width: 152 mm, Package depth: 242 mm, Package height: 141 mm. Processor package size: 35mm x 35mm. Cache memory: 1 MB

Intel Core i3-13100. Processor family: Intel® Core™ i3, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. On-board graphics card model: Intel UHD Graphics 730, On-board graphics card outputs supported: Embedded DisplayPort (eDP) 1.4b, DisplayPort 1.4a, HDMI 2.1, On-board graphics card base frequency: 300 MHz. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express slots version: 5.0, 4.0. Package type: Retail box

Intel Xeon E5-2403. Processor family: Intel® Xeon® E5 Family, Processor socket: LGA 1356 (Socket B2), Processor lithography: 32 nm. Memory channels: Triple-channel, Maximum internal memory supported by processor: 375 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Package width: 44 mm, Package depth: 140 mm, Package height: 117 mm. Processor package size: 45mm x 42.5mm