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In Stock
Asrock H610M-HDV/M.2 R2.0 – LGA1700
Asrock H610M-HDV/M.2 R2.0. Processor manufacturer: Intel, Processor socket: LGA 1700, Compatible processor series: Intel® Celeron® G, Intel® Core™ i3, Intel® Core™ i5, Intel® Core™ i7, Intel® Core™…. Supported memory types: DDR4-SDRAM, Maximum internal memory: 64 GB, Memory slots type: DIMM. Supported storage drive interfaces: M.2. Graphics card family: Intel, Graphics card: Intel Iris Xe Graphics, Maximum resolution: 7680 x 4320 pixels. USB connector type: USB Type-A
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CPU INTEL Core I7-6900K 3.70 GHz LG2011-v3 BX80671I76900K
Intel Core i7-6900K. Processor family: Intel® Core™ i7 X-series, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Desktop, Scalability: 1S, Export Control Classification Number (ECCN): 5A992C. Intel® Turbo Boost Max Technology 3.0 frequency: 4 GHz. Package width: 44 mm, Package depth: 116 mm, Package height: 101 mm
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ENGENIUS SFP MODULE 1.25g mmf 85 Onm 0.5km
EnGenius SFP2185-05 network transceiver module 1.25G Multi-Mode Fiber 850nm 0.5km. Maximum data transfer rate: 1250 Mbit/s, Interface type: SFP, Fiber optic connector: LC. Product colour: Blue, Silver. Maximum voltage: 3.45 V, Maximum current: 0.16 A. Width: 13.7 mm, Depth: 56.6 mm, Height: 12.4 mm. Number of products included: 1 pc(s)
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CPU MOBILE INTEL Celeron 540 1.86GHz FSB533 1MB 65nm FCPGA
Intel 540. Processor family: Intel® Celeron® M, Processor socket: Socket 478, Processor lithography: 65 nm. Market segment: Mobile, Number of Processing Die Transistors: 291 M, Processing Die size: 143 mm². Package width: 152 mm, Package depth: 242 mm, Package height: 141 mm. Processor package size: 35mm x 35mm. Cache memory: 1 MB
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A154 Asrock B760M-HDV/M.2 D4 DDR4 – LGA1700
Asrock B760M-HDV/M.2 D4. Processor manufacturer: Intel, Processor socket: LGA 1700, Compatible processor series: Intel® Core™ i3, Intel® Core™ i5, Intel® Core™ i7, Intel® Core™ i9. Supported memory types: DDR4-SDRAM, Maximum internal memory: 64 GB, Memory slots type: DIMM. Supported storage drive interfaces: M.2, SATA III, RAID levels: 0, 1, 5, 10. Ethernet interface type: Gigabit Ethernet, LAN controller: Realtek RTL8111H. Component for: PC, Motherboard form factor: micro ATX, Motherboard chipset family: Intel
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ENGENIUS SFP MODULE 1.25G SMF 131Onm 10km
EnGenius SFP2213-10 network transceiver module 1.25G Single-Mode Fiber 1310nm 10km. Maximum data transfer rate: 1250 Mbit/s, Interface type: SFP, Fiber optic connector: LC. Product colour: Blue, Silver. Maximum voltage: 3.45 V, Maximum current: 0.16 A. Width: 13.7 mm, Depth: 56.6 mm, Height: 12.4 mm. Number of products included: 1 pc(s)
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EnGenius SkyKey AP Controller 50AP 2Lan PoE.af-in microSD
EnGenius SkyKey on-premises network management platform with built-in ezMaster support up to 100 device (AP+Switch). Networking standards: IEEE 802.11k, IEEE 802.3, IEEE 802.3ab, IEEE 802.3af, IEEE 802.3at, IEEE 802.3u, Ethernet LAN data rates: 10,100,1000 Mbit/s. Security algorithms: AES, WPA-EAP, WPA2. Connectivity technology: Wired. Product colour: White, Certification: FCC CE EN 55032 EN 55035. Total storage capacity: 4 GB
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ENGENIUS ECW120 Indoor AP 802.11a/b/g/n/ac 2×2:2 GbLan
EnGenius ECW120 Cloud Managed AP Dual Band 11ac Wave2 400+867+scan 2T2R GbE PoE.at 4*5dBi ia. Maximum data transfer rate: 867 Mbit/s, Maximum data transfer rate (2.4 GHz): 400 Mbit/s, Maximum data transfer rate (5 GHz): 867 Mbit/s. Security algorithms: 64-bit WEP, 128-bit WEP, 152-bit WEP, SSH, WPA, WPA-AES, WPA-EAP, WPA-TKIP, WPA2, Service Set Identifier (SSID) features: Multiple SSIDs. Management protocols: SNMP. Power consumption (max): 12 W. Placement: Ceiling, Wall, Product colour: White, Cable lock slot type: Kensington
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In Stock
CPU INTEL Core i3-13100 3.4Ghz LGA 1700 4C/8T Tray
Intel Core i3-13100. Processor family: Intel® Core™ i3, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. On-board graphics card model: Intel UHD Graphics 730, On-board graphics card outputs supported: Embedded DisplayPort (eDP) 1.4b, DisplayPort 1.4a, HDMI 2.1, On-board graphics card base frequency: 300 MHz. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express slots version: 5.0, 4.0. Package type: Retail box
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ENGENIUS Dual band Wireless N900 Managed Indoor Access Point
EnGenius EWS320AP. Maximum data transfer rate: 450 Mbit/s, Wi-Fi data rate (max): 450 Mbit/s, Ethernet LAN data rates: 10,100,1000 Mbit/s. Security algorithms: 802.1x RADIUS, EAP-MD5, EAP-TLS, EAP-TTLS, SNMP, SSID, WPA, WPA-AES, WPA-EAP, WPA-PSK, WPA-TKIP,…. Management protocols: SNMP v1/v2c, MIB I/II. Switch type: Managed. WAN connection: Ethernet (RJ-45)
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CPU INTEL Xeon E5-2403 10MB Cache 1.80GHz 6.4 GT/s Intel QPI
Intel Xeon E5-2403. Processor family: Intel® Xeon® E5 Family, Processor socket: LGA 1356 (Socket B2), Processor lithography: 32 nm. Memory channels: Triple-channel, Maximum internal memory supported by processor: 375 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Package width: 44 mm, Package depth: 140 mm, Package height: 117 mm. Processor package size: 45mm x 42.5mm
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2.5″ INTEL SSD DC S3610 Series 800GB, SATA 6Gb/s, 20nm, MLC
Intel DC S3610. SSD capacity: 800 GB, SSD form factor: 2.5″, Read speed: 500 MB/s, Write speed: 450 MB/s, Data transfer rate: 6 Gbit/s
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INTEL Integrated RAID Module RMS3HC080
Intel RMS3HC080. Supported storage drive interfaces: SAS, Serial ATA, Host interface: PCI Express x8. RAID levels: 0, 1, 10, 5, 50, Data transfer rate: 12 Gbit/s, Form factor: Storage Connector Module. Built-in processor: SAS3008, Processor family: LSI, Processor model: LSISAS3008. Compatible operating systems: Windows, Linux, VMware. Packaging content: (1) Intel Integrated RAID Module RMS3HC080, (4) standoffs, and (4) standoff locking pins
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In Stock
CPU INTEL Core I7-13700 3.4GHz 30MB 16C/24T LGA1700 BOX
Intel Core BX8071513700. Processor family: Intel® Core™ i7, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. On-board graphics card model: Intel UHD Graphics 770, On-board graphics card outputs supported: Embedded DisplayPort (eDP) 1.4b, DisplayPort 1.4a, HDMI 2.1, On-board graphics card base frequency: 300 MHz. Market segment: Desktop, Use conditions: PC/Client/Tablet, Workstation, PCI Express slots version: 5.0, 4.0. Intel® Turbo Boost Max Technology 3.0 frequency: 5.2 GHz
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CPU INTEL Core I9-13900F 2Ghz 36Mb 24C/32T LGA1700 BOX
Intel Core i9-13900F. Processor family: Intel® Core™ i9, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 192 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express slots version: 5.0, 4.0. Intel® Turbo Boost Max Technology 3.0 frequency: 5.5 GHz, Intel® Thermal Velocity Boost Frequency: 5.6 GHz. Package type: Retail box
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ENGENIUS Dual band Wireless N1733 Managed Indoor Access Pnt.
EnGenius EWS370AP. Maximum data transfer rate: 1733 Mbit/s, Wi-Fi data rate (max): 1733 Mbit/s, Ethernet LAN data rates: 10,100,1000 Mbit/s. Security algorithms: HTTPS, SNMPv3, SSH, WPA, WPA2. Switch type: Managed. Placement: Ceiling, Wall, Product colour: White, LED indicators: LAN, Power. Antenna features: Detachable antenna, Antenna gain level (max): 3 dBi
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In Stock
ENGENIUS ECW160 Outdoor AP 802.11a/b/g/n/ac 2×2:2 GbLan Dual
EnGenius ECW160 Cloud Managed Outdoor AP Dual Band 11ac Wave2 400+867Mbps 2T2R 4x5dBi RP-SMA GbE PoE.af IP67. Maximum data transfer rate: 867 Mbit/s, Maximum data transfer rate (2.4 GHz): 400 Mbit/s, Maximum data transfer rate (5 GHz): 867 Mbit/s. Security algorithms: SSH, WPA2-AES, WPA2-Enterprise, WPA2-PSK, Service Set Identifier (SSID) features: Multiple SSIDs. Management protocols: SNMP. Power consumption (max): 12.6 W. Placement: Pole, Wall, Product colour: White, Certification: FCC, CE, IC